TheTechno Optimist.

CoWoS advanced packagingTSMC—TSMC and GlobalFoundries partner on U.S. production of advanced packaging componentsESMC Dresden fabTSMC—ESMC tops out its Dresden fab 25 months after groundbreaking; tool install set for second half of 2027N2 processTSMC—Court sentences a former TSMC engineer to 10 years in the 2 nm trade-secret case; Tokyo Electron's unit is finedCoWoS advanced packagingTSMC—TSMC signs $2 billion deal for GlobalFoundries to make CoWoS silicon interposers in New YorkJASM Kumamoto fabsTSMC—Taiwan approves 3nm for TSMC's second Kumamoto fab, with production from 2028CoWoS advanced packagingTSMC—TSMC and Amkor sign a 10-year agreement for advanced packaging and test in ArizonaTSMC ArizonaTSMC—TSMC reportedly pulls Arizona Fab 2 forward: tool installation in Q3 2026, 3 nm production in 2027

JASM Kumamoto fabs

by TSMCTW

Give Japan a local supply of logic chips, first mature chips for its car and image-sensor makers, then leading-edge 3 nm for AI, while spreading TSMC's production beyond Taiwan.

DeployStage 4 of 5

Fab 1 in volume production since Dec 2024; Fab 2 switched to 3 nm, with production due in 2028.

Updated 31 Mar 2026Checked 11 Oct0 updates this week

Milestones

Next · Fab 2 tool install and production start (3 nm)
  1. Fab 1 construction startsApr 2022Complete.
  2. Fab 2 announced; Toyota joins JASM6 Feb 2024Complete.
  3. Fab 1 opening ceremony24 Feb 2024Complete.
  4. Fab 1 mass production (12-28 nm)Dec 2024Complete.
  5. Taiwan approves 3 nm for Fab 231 Mar 2026Complete.
  6. Fab 2 tool install and production start (3 nm)Target 2028+12 mooriginally 2027Current milestone.

Most important updates

Upcoming

  1. 2028Fab 2 tool install and production start (3 nm)+12 mooriginally 2027 (next)
Primer