TSMC signs $2 billion deal for GlobalFoundries to make CoWoS silicon interposers in New York

TSMC/CoWoS advanced packaging

TSMC and GlobalFoundries signed a $2 billion, five-year manufacturing agreement under which GlobalFoundries will make silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York facility. It would be the first US-based source of these parts, but production is only set to ramp in the first half of 2028.

• The deal is a multiyear manufacturing agreement with an initial term of five years; the article does not say whether the $2 billion is investment, revenue or both.
• GlobalFoundries says the work includes embedded deep trench capacitor components, and that Malta would be the first US-based source of silicon interposers for advanced packaging.
• No output volumes or capacity figures have been given, so the Malta expansion produces nothing near-term.
• The figures come from company announcements; the article notes that the value of the capacity depends on continued AI and high-performance computing demand.