TSMC and GlobalFoundries partner on U.S. production of advanced packaging components

TSMC/CoWoS advanced packaging

TSMC and GlobalFoundries announced a five-year, $2 billion deal to build advanced packaging interposers—key components in TSMC's CoWoS chiplet packages—at GlobalFoundries' Malta, New York facility. The agreement marks the first domestic production line for this critical component. GlobalFoundries and TSMC expect to ramp production in the first half of 2028, with terms for scaling capacity over time. The move helps secure supply chains for high-end AI and data center chips.

• Five-year deal worth $2 billion for interposer manufacturing
• First U.S.-based production of interposers for TSMC's CoWoS packages
• GlobalFoundries Malta, New York site chosen for initial production
• Volume ramp targeted for H1 2028, with capacity expansion options
• Supports U.S. semiconductor manufacturing and TSMC's advanced packaging supply security