TSMC and Amkor sign a 10-year agreement for advanced packaging and test in Arizona

TSMC/CoWoS advanced packaging

TSMC and Amkor signed a 10-year agreement under which TSMC will buy advanced packaging and test services, including CoWoS, from Amkor's Peoria, Arizona facility. The deal turns their 2024 memorandum into a long-term commitment, allowing chips made in TSMC's Phoenix fabs to be packaged locally for a fully US-based production flow.

• 10-year commitment for advanced packaging (2.5D, 3D integration, CoWoS) and testing at Amkor's Peoria facility.
• Reduces product cycle times by integrating front-end (TSMC fab) and back-end (Amkor packaging) processes.
• TSMC plans to establish its own advanced packaging facility in Arizona by 2029 with CoWoS and 3D-IC capacity.