The brief

Analyst view

• FY2026 (to June) revenue was $13.58B; process control alone brought in $12.2B.
• Expects about $1.1B from advanced-packaging inspection in 2026, as AI chips stack dies and memory.
• Analyst estimates put its process-control market share at over six times that of its nearest rival.

Technical approach

As reported

Optical

Fast light-based inspection

Broadband plasma and laser scanners sweep whole wafers with deep-ultraviolet light and flag tiny pattern defects at production speed.

E-beam

Electron beams for the smallest flaws

Electron-beam tools see defects light cannot, and review tools image each suspect so engineers learn what went wrong.

Software

Data that links tools to causes

Deep-learning classifiers sort millions of hits into real defects and noise, and tie them back to the process step that caused them.

Packaging

Inspection beyond the wafer fab

Since buying Orbotech in 2019, KLA also inspects packaged chips, substrates and boards, where AI-chip stacking now adds many steps.

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