by KLAUS
Keep yields high as AI processors and high-bandwidth memory stack many chips together, where one bad die or joint can scrap an expensive package.
About $1.1B expected in 2026, up more than 70%; tools span wafers, dies and substrates.
Updated 28 Jul 2026Checked 11 Oct0 updates this week
Kronos tools scan wafers after packaging steps like bumping and redistribution wiring, with AI sorting real defects from noise.
ICOS systems inspect diced chips from all sides, including infrared that sees cracks inside silicon, before they go into a package.
Lumina inspects and measures large organic and glass-core substrates; Corus and Serena pattern their fine wiring with lasers.
| Spec | Advanced-packaging process control |
|---|---|
| Packaging revenue, CY2026 outlook | ~$1.1BR (reported) |
| ICOS F160XP full-IR inspection speed | 2x previous generationR (reported) |
R reported by the company
KLA
Wafer inspection, metrology, packaging process control
KLA makes the machines that find defects and measure patterns on chips as they are made, so factories catch problems before they ruin whole batches of wafers. It is the largest supplier of this process-control equipment, with $13.6B revenue in fiscal 2026.
