KLA unveils IC substrate portfolio including Lumina inspection for glass-core substrates

KLA/Advanced-packaging process control

KLA introduced tools for making the substrates that sit between advanced chips and circuit boards. Lumina inspects and measures organic and glass-core substrates and panel interposers; Serena and an upgraded Corus pattern fine wiring with direct laser imaging.

• Lumina uses AI-based defect classification.
• Serena targets large, high-layer-count organic substrates.
• Aimed at chiplet-based high-performance chips that need denser substrates.