TSMC reportedly set to roughly double CoWoS capacity in 2025, to about 75,000 wafers a month

TSMC/CoWoS advanced packaging

TSMC planned to nearly double its CoWoS advanced-packaging capacity in 2025 to approximately 75,000 wafers monthly, using recently acquired Innolux plant (AP8) and Taichung facilities, while construction timelines accelerated from 3–5 years to 1.5–2 years due to AI chip demand.

• Capacity target of 75,000 wafers per month in 2025 represents roughly double 2024 output; expansion uses Innolux-acquired capacity plus existing Taichung facilities.
• Construction timeline compressed from 3–5 years to 1.5–2 years to meet AI demand; packaging partners ASE and Amkor also expanding capacity, potentially exceeding 75,000-wafer target.
• Projected compound annual growth rate exceeding 50% from 2022 to 2026 reflects bottleneck in advanced packaging for AI accelerators like NVIDIA GPUs.