TSMC and Amkor agree to bring CoWoS and InFO packaging to Amkor's planned Arizona plant

TSMC/CoWoS advanced packaging

TSMC and Amkor signed a memorandum of understanding for Amkor to provide turnkey advanced packaging at its planned Peoria, Arizona plant using TSMC's CoWoS and InFO technologies, allowing chips to be made and assembled in the US rather than shipped back to Asia.

• Amkor's Peoria, Arizona facility will deliver TSMC's Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging services.
• Partnership collocates TSMC's front-end fab in Phoenix with Amkor's back-end facility, accelerating product cycle times through closer collaboration.
• Addresses high-performance computing and communications chip packaging needs domestically, reducing supply-chain complexity for TSMC customers.