TSMC plans 9.5-reticle CoWoS for 2027, fitting 12 or more HBM stacks in one package

TSMC/CoWoS advanced packaging

TSMC said it plans to bring a 9.5-reticle-size version of its CoWoS advanced packaging to volume production in 2027, able to fit 12 or more HBM memory stacks in one package. Larger packages let AI accelerators combine more compute and memory on a single substrate.

• 9.5-reticle CoWoS: volume production targeted for 2027; supports 12+ HBM stacks per package vs. fewer on smaller reticle sizes.
• Addresses AI demand for tighter logic-to-memory coupling; each additional HBM stack increases bandwidth and capacity.
• Also introducing System-on-Wafer (SoW-X) for 2027 with 40x greater computing power than current CoWoS.