StoryManufacturing
GlobalFoundries to make TSMC's CoWoS silicon interposers in New York under $2B, five-year deal
GlobalFoundries announced on October 8, 2026 a roughly $2 billion, five-year agreement to make silicon interposers for TSMC at its Malta, New York fab. Interposers are a core part of TSMC's CoWoS packaging, which is used to make Nvidia AI accelerators, and until now they have been produced almost entirely in Taiwan. Volume production is expected to ramp in the first half of 2028.
- Value of approximately US$2 billion; initial term of five years, with a framework for more capacity if demand keeps growing.
- The Malta capacity will not immediately change CoWoS supply; the 2028 ramp reflects equipment installation, process transfer and customer qualification.
- GlobalFoundries does not make TSMC's leading-edge logic wafers and does not take over CoWoS packaging; the deal covers interposers.
- GlobalFoundries calls it the first U.S.-based source of these parts for TSMC; that is the company's own description.
- One report gives October 9 as the signing date; the figures come from a secondary summary, not a primary release.