The brief

Analyst view

• Spun from WD Feb 2025, trades on Nasdaq as SNDK. Sep 2026 market cap: US$255B.
• Co-leads HBF standard with SK Hynix to bridge capacity-speed gap for AI.
• HBF samples 2H 2026, production devices early 2027: 512GB at 1.6TB/s.

Technical approach

As reported

3D NAND

Stacked layers

Multiple stacked NAND layers increase capacity and density.

HBF

Memory tier for AI

512GB capacity with 3TB/s bandwidth between HBM and SSDs.

Standards

UCIe interface

Universal Chiplet Interconnect via Open Compute Project.