The brief

Analyst view

• $12 billion two-phase campus in Peoria, Arizona; investment increased in September 2026.
• Phase 1 (33,000 sqm) mid-2027, production early 2028. Phase 2 (60,000 sqm) late 2027–end 2029.
• 10-year TSMC partnership supplies wafers. Apple and Nvidia anchor customers. CoWoS for AI, HPC.

Technical approach

As reported

Advanced Packaging

Chiplet and interconnect

CoWoS, bumping, multi-die assembly for high-performance computing and AI.

Test Services

Wafer and package test

Comprehensive testing from sort to final package for quality and reliability.

U.S. Manufacturing

Domestic OSAT ecosystem

Arizona campus serves U.S., allies; reduces Taiwan, SE Asia reliance.