Arizona Advanced Packaging & Test by Amkor Technology: status and timeline

Milestones

Next · Phase 1 first manufacturing facility operational

Site selection announced in Peoria Innovation CoreNov 2023Complete.
Land acquisition and site preparationAug 2025Complete.
Phase 1 groundbreaking ceremony6 Oct 2025Complete.
Phase 1 first manufacturing facility operationalTarget Jun 2027Not yet reached.
Phase 1 production rampTarget Q1 2028Not yet reached.
Phase 2 construction beginsTarget Q4 2027Not yet reached.
Phase 2 construction completeTarget Q4 2029Not yet reached.

Most important updates

Upcoming

Jun 2027Phase 1 first manufacturing facility operationalin about 33 weeks (next)
Q4 2027Phase 2 construction begins
Q1 2028Phase 1 production ramp
Q4 2029Phase 2 construction complete

Current obstacles

Equipment supply for scale-upBumping, test handler tools have long lead times. Phase 2 tool sourcing critical.
Workforce trainingSkilled technicians and engineers in short supply. Must train locals.
Customer ramp speedApple, Nvidia qualify slowly. Volume depends on their product cycles.

Physics limits

Building capacity takes yearsConstructing 750,000 sq ft of cleanroom, installing equipment, and reaching volume production typically requires 2–3 years from groundbreaking.
Chiplet density is power-limitedHigh-density multi-die packages dissipate significant power. Thermal management and substrate design set limits on how many dies can be integrated per package.
Substrate supply is finiteSpecialized substrates for advanced packaging are made by a few vendors. If one supplier faces disruptions, Amkor's throughput may be constrained.

How it works

3 parts

Vertically integrated supply

Wafer supply from adjacent TSMC Arizona fabs

TSMC's Peoria fabs supply wafers directly to Amkor for packaging, reducing transport, delays, and costs. First major U.S.-based wafer-to-package flow.

Chiplet packaging

Multi-die assembly for AI and HPC

CoWoS stacks logic, memory, and I/O chiplets in dense 3D configurations for high-bandwidth applications.

Testing and validation

Wafer and package-level quality

In-line wafer testing during fabrication, final package testing, and burn-in screening ensure yield above 85% and field reliability.

Spec sheet

Spec	Arizona Advanced Packaging & Test
Total cleanroom space (both phases)	93,000 sq m (Phase 1: 33,000; Phase 2: 60,000)^R (reported)
Facility cleanroom space	~750,000 sq ft^R (reported)
Total campus investment	$12 billion^R (reported)
Initial campus land	104 acres (Peoria Innovation Core) + 67-acre option^R (reported)
Jobs created (both phases)	3,500+^R (reported)

^R reported by the company

Update log

3 updates

About Amkor Technology

The team behind Arizona Advanced Packaging & Test

Amkor Technology

OSAT advanced packaging assembly test

Amkor, the world's largest U.S. OSAT (outsourced assembly and test) provider, is building a $12 billion advanced packaging campus in Arizona in partnership with TSMC to support AI and HPC chip assembly for major customers including Apple and Nvidia.

$12 billion two-phase campus in Peoria, Arizona; investment increased in September 2026.
Phase 1 (33,000 sqm) mid-2027, production early 2028. Phase 2 (60,000 sqm) late 2027–end 2029.
10-year TSMC partnership supplies wafers. Apple and Nvidia anchor customers. CoWoS for AI, HPC.

amkor.com (opens amkor.com)Company profile →

Founded: 196858 yrs
Headquarters: United States
Status: Public
Valuation: public
Works in: ComputingPackaging & memory
Coverage: 1 program · 3 updateslatest 8 Sep 2026checked 11 Oct
Customers: Apple (opens apple.com)Nvidia (opens nvidia.com)
Partners: TSMC (opens businesswire.com)

Spec

Arizona Advanced Packaging & Test

Total cleanroom space (both phases)

93,000 sq m (Phase 1: 33,000; Phase 2: 60,000)^R (reported)

Facility cleanroom space

~750,000 sq ft^R (reported)

Total campus investment

$12 billion^R (reported)

Initial campus land

104 acres (Peoria Innovation Core) + 67-acre option^R (reported)

Jobs created (both phases)

3,500+^R (reported)

Arizona Advanced Packaging & Test

Milestones

Most important updates

Upcoming

Current obstacles

Physics limits

How it works

Wafer supply from adjacent TSMC Arizona fabs

Multi-die assembly for AI and HPC

Wafer and package-level quality

Spec sheet

Update log

Tue 8 Sep

Tue 16 Jun

Thu 28 May

About Amkor Technology

Current obstacles

Physics limits

How it works

Wafer supply from adjacent TSMC Arizona fabs

Multi-die assembly for AI and HPC

Wafer and package-level quality

Spec sheet

Update log

Tue 8 Sep

Tue 16 Jun

Thu 28 May

About Amkor Technology