TSMC and Amkor establish 10-year partnership for U.S. advanced packaging

Amkor Technology/Arizona Advanced Packaging & Test

TSMC and Amkor formalized a 10-year partnership to supply advanced packaging and test services. TSMC's Peoria wafer fabs will feed Amkor's adjacent packaging campus, creating the first fully U.S. integrated wafer-to-package flow for high-volume chips. The deal targets AI, HPC, and mobile applications; Apple and Nvidia are anchor customers.

• TSMC Arizona wafers shipped directly to Amkor for packaging and test, eliminating international transport.
• Supports Apple silicon packaging from TSMC Peoria wafers; Nvidia GPU and related components.
• Serves AI accelerators, graphics processors, and mobile chips requiring advanced chiplet integration.
• First U.S. end-to-end ecosystem for advanced semiconductor packaging at scale.