TSMC says it will not use High-NA EUV for its A14 node, citing cost

ASML/High-NA EUV (EXE)

TSMC senior vice president Kevin Zhang said at its North America Technology Symposium that A14 will use standard 0.33-NA EUV instead of ASML's High-NA machines, which could raise costs 2.5 times. TSMC plans High-NA for the later A14P (2029), leaving Intel as the earliest adopter.

• TSMC A14 (2028): standard 0.33-NA EUV lithography; High-NA cost premium too steep for initial node.
• High-NA cost concern: technology could raise production costs 2.5x vs. conventional EUV, limiting consumer-product economics.
• A14P (2029): planned High-NA adoption; Intel and Samsung moving faster, both already deploying High-NA tools.