Intel says it has processed about 30,000 wafers on two High-NA EUV tools, which are about twice as reliable as earlier EUV

ASML/High-NA EUV (EXE)

Intel engineer Steve Carson reported at the SPIE lithography conference that Intel's two ASML High-NA EUV machines in Oregon had processed about 30,000 wafers in a quarter and were approximately twice as reliable as earlier EUV tools. High-NA prints finer lines in one exposure; Intel plans to use it for its 14A process.

• Intel's High-NA EUV progress: ~30,000 wafers processed; reliability about 2x that of conventional EUV.
• High-NA advantage: prints finer features in fewer exposures vs. multi-patterning conventional EUV.
• Intel 14A: planned to use High-NA; adoption ahead of TSMC (skipping High-NA for A14) and competitive with Samsung.