The brief

Analyst view

• H1 2026 orders €562.6M, up 116.5% on H1 2025, led by hybrid bonding, photonics and data-centre computing.
• Applied Materials owns 9% and co-develops Kinex, an integrated die-to-wafer hybrid bonding line.
• SK hynix pushed hybrid bonding in HBM back a generation (Aug 2026), delaying Besi's memory upside.

Technical approach

As reported

Placement

Placing chips to within 100 nm

Its latest hybrid bonder places each die on a wafer with 100 nm accuracy, so copper pads a few microns wide line up with the pads below.

Partner

Front-end prep plus back-end placement

Applied Materials supplies the cleaning, plasma activation and metrology steps; Besi supplies the die placement. Kinex puts both in one sealed tool.

Two tracks

Hybrid bonding and thermocompression

Chipmakers buy both: thermocompression bonders press chips together through tiny solder bumps today, hybrid bonders replace bumps at finer pitch.