The brief
- Covington, Georgia plant built; embedded-glass samples in reliability testing in Taiwan as of July 2026.
- Mass production has slipped from 2024 to 2027; SKC no longer gives a firm date.
- Raising ₩401.1B (Aug 2026) for customer qualification and yield; CHIPS Act award up to $75M.
Technical approach
Core
Glass instead of resin
The package core is a glass panel, which stays flat as large hot chips grow and lets wiring be finer and denser than on organic resin.
Embedding
Parts built into the glass
Its flagship design embeds capacitors and other small parts in the glass, which it says can cut package height from 3.9 mm to 1.8 mm.
Process
About 190 steps
Making a panel takes about 190 steps drawn from substrate, display and chip industries, before inspection.
