Besi joins Applied Materials' EPIC Center, widening their hybrid bonding partnership

Besi (BE Semiconductor Industries)/Besi hybrid bonding systems

Besi became an Innovation Partner at Applied Materials' EPIC Center in Silicon Valley, extending a collaboration that began in 2020 at a joint hybrid bonding centre in Singapore and produced Kinex. Joint R&D now covers new die-to-wafer hybrid bonders, thermocompression bonding, die-on-panel integration and co-packaged optics.

• Besi engineers will work alongside Applied's teams at the EPIC Center.
• Applied brings etch, planarization, deposition, cleaning and metrology; Besi brings die placement.
• EPIC capital spending is expected to grow to about $5B over time.