Besi Q1 orders double to €269.7M on a jump in hybrid bonding bookings

Besi (BE Semiconductor Industries)/Besi hybrid bonding systems

Besi's first-quarter orders reached €269.7M, up 104.5% on a year earlier, driven by a significant increase in hybrid bonding bookings. Revenue rose 28.3% to €184.9M on shipments for high-end phones and 2.5D AI computing.

• Orders €269.7M (+104.5% y/y); revenue €184.9M (+28.3% y/y).
• Strength in hybrid bonding, mobile and photonics applications.
• Hybrid bonding adoption widened to about twenty customers, per Bits&Chips.
• Guided Q2 revenue up 30-40% on Q1.