Lightmatter and GUC partner to produce co-packaged optics for AI hyperscalers

Lightmatter/Passage

Lightmatter and Taiwan's GUC, a chip-design services firm with TSMC as largest shareholder (35%), partnered to offer co-packaged optics combining Lightmatter's Passage photonic interconnect with GUC's custom chip design and packaging. Co-packaged optics places the optical link next to the processor, cutting power and raising bandwidth between chips.

• GUC is Taiwan-based, publicly traded, with TSMC as 35% shareholder and sole foundry supplier.
• Partnership integrates Passage platform with GUC's ASIC design and advanced packaging workflows.
• Joint solution addresses architectural, thermal, mechanical, and signal integrity challenges for hyperscale AI data centers.