StoryPartnership
Lightmatter and Amkor partner to build the largest 3D photonics package, for Passage
Lightmatter and Amkor partnered to build the industry's largest 3D-packaged chip complex, stacking customer chips directly on Lightmatter's Passage photonic interconnect. This enables optical input/output anywhere across the chip area rather than only edges, raising bandwidth between AI processors.
- Passage platform uses 3D-stacked silicon photonic engine with optical I/O across the entire chip surface, eliminating traditional electrical bottlenecks of edge-only connections.
- Partnership delivers the industry's largest multi-reticle die complex on organic substrate within a 3D package, enabling next-generation AI and HPC systems.
- Photonic approach reduces power consumption and thermal issues as AI processors scale; natively integrates Optical Circuit Switching for enhanced resiliency and flexibility.