Besi wins order for 26 hybrid bonding systems from a leading logic chipmaker

Besi (BE Semiconductor Industries)/Besi hybrid bonding systems

Besi received an order for 26 hybrid bonding systems from an unnamed leading logic manufacturer, for its newest machine with 100 nm placement accuracy. CEO Richard Blickman said it showed a second leading logic maker adopting hybrid bonding for its most advanced data-centre chips.

• 26 systems of the latest generation, with 100 nm placement accuracy.
• Deliveries scheduled for Q4 2024 and Q1 2025.
• Besi said it expected further hybrid bonding orders from other customers that quarter.