Applied Materials buys 9% of Besi to deepen their hybrid bonding partnership

Besi (BE Semiconductor Industries)/Besi hybrid bonding systems

Applied Materials bought 9% of Besi's shares on the market, building on a collaboration since 2020 to make the first fully integrated equipment for die-based hybrid bonding. Applied said copper-to-copper bonds raise connection density and shorten wiring between chiplets, improving performance, power and cost.

• 9% stake bought through market transactions; no regulatory approval needed.
• Applied said it would not seek a board seat or buy more shares.
• The two firms extended their agreement to co-develop an integrated hybrid bonding system.