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ASE unveils fully automated 310 mm panel-level packaging line for AI chips

ASE TechnologyLeading-edge advanced packaging (VIPack)

ASE launched an automated production line that builds fan-out packages on 310 x 310 mm square panels instead of round wafers. Square panels hold more large AI packages per run, and the line supports both FOCoS and FOCoS-Bridge.

  • Panel size 310 x 310 mm, up to 96,100 mm² usable.
  • Wiring down to 2/2 µm (FOCoS) and 8/8 µm (FOCoS-Bridge).
  • Production expected in the first half of 2027.
  • Aimed at AI, HPC, networking and edge AI chips.
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