ASE adds through-silicon vias to FOCoS-Bridge, cutting power loss threefold for AI packages

ASE Technology/Leading-edge advanced packaging (VIPack)

ASE added vertical connections through the silicon bridges in its FOCoS-Bridge packages, giving power a shorter path to the chips. It reported far lower resistance and inductance than the earlier design, on an 85 x 85 mm test vehicle.

• Power loss cut about 3x versus standard FOCoS-Bridge.
• Resistance down 72%, inductance down 50%.
• Test vehicle 85 x 85 mm, with three wiring layers at 5 µm line width.
• Part of ASE's VIPack platform for AI and HPC.