TheTechno Optimist.

Intel 18AIntel—Intel launches Panther Lake, its first 18A processors, at CESXeon 6+ (Clearwater Forest)Intel—Intel launches Xeon 6+ (Clearwater Forest), first 18A server CPU with up to 288 E-coresCrescent IslandIntel—Intel announces Crescent Island, an inference-optimized Xe3P GPU with 160 GB LPDDR5X, sampling H2 2026Advanced Packaging (EMIB-T / Foveros)Intel—Intel showcases EMIB-T advanced packaging with through-silicon vias for multi-kilowatt AI acceleratorsSilicon spin qubitsIntel—Argonne National Laboratory and Intel put a 12-qubit Tunnel Falls processor into operation as a research testbed

Advanced Packaging (EMIB-T / Foveros)

by IntelUS

Join several chips into one package with dense links and stacking. As single chips hit size and yield limits, packaging is how the biggest processors keep growing.

ProtoStage 2 of 5

EMIB-T production rollout 2026 for multi-kilowatt AI accelerators.

Updated 11 Jul 2026Checked 11 Oct0 updates this week

Milestones

Next · EMIB-T production fab rollout
  1. EMIB-T announced with TSV capability2025Complete.
  2. EMIB-T production fab rolloutTarget 2026Current milestone.
  3. Nvidia Feynman partnership announcedSep 2025Complete.
  4. Google TPUv8e integrates EMIBTarget 2027Not yet reached.

Most important, last 3 months

Upcoming

  1. 2026EMIB-T production fab rollout (next)
  2. 2027Google TPUv8e integrates EMIB
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