Intel showcases EMIB-T advanced packaging with through-silicon vias for multi-kilowatt AI accelerators

Intel/Advanced Packaging (EMIB-T / Foveros)

Intel unveiled EMIB-T, an advanced packaging technology adding through-silicon vias to its EMIB interposer, enabling multi-kilowatt AI accelerators. The technology enables direct power delivery for HBM4-class power budgets. Nvidia, Microsoft, and Google are designing custom AI chips to use EMIB and Foveros. EMIB-T entered production fab rollout in 2026.

• Through-silicon vias (TSVs) enable direct power delivery to chiplets, supporting HBM4-class power budgets.
• Nvidia's $5B Intel investment includes use of both EMIB and Foveros packaging.
• Microsoft Maia operates under a $15B lifetime contract with Intel Foundry.
• Foveros stacking expands the reticle limit by 8x today, roadmapped to 12x+ by 2028.
• Addresses a key gap: prior EMIB could not handle multi-kilowatt loads on large AI accelerators.