StoryRegulatory
EU approves €5B German aid for ESMC as TSMC and partners break ground on Dresden fab
The European Commission cleared a €5B German subsidy for ESMC, the TSMC-led joint venture with Bosch, Infineon and NXP, on the day the Dresden fab broke ground. The plant will make 28/22 nm and 16/12 nm chips on 300 mm wafers for car and industrial uses, and must sell to any customer, not only its owners.
- €5B in German state aid, cleared by the European Commission under EU state-aid rules
- Target: 480,000 wafers a year at full capacity by 2029
- Open foundry: any customer can order chips
- Ownership: TSMC 70%, Bosch, Infineon and NXP 10% each