FPA-1200NZ2C by Canon: status and timeline

Milestones

No announced next step

FPA-1200NZ2C announced13 Oct 2023Complete.
First system delivered to Texas Institute for Electronics26 Sep 2024Complete.

Most important updates

Current obstacles

Mold creation is expensiveMaster molds need EUV or e-beam lithography. Design changes require new molds.
Throughput slower than EUVLower wafers per hour raises cost without high mold reuse.

Physics limits

Mechanical contact causes defectsAlignment and pressure must be precise. Resists can tear; molds wear from repeated use.
High mold cost per designEach design needs a unique mold costing millions. High volume needed to amortize.

How it works

3 parts

Stamp

Hard mold transfers pattern

Mold is pressed into resist on wafer; pattern transfers directly without optical projection.

Materials

Works on many substrates

Not limited to silicon; works on glass, polymers for displays, optics, biodevices.

Molds

Reusable but expensive

Molds durable and reused thousands of times. Master mold requires EUV or e-beam.

Spec sheet

Spec	FPA-1200NZ2C
Minimum feature size	Sub-5nm class^R (reported)

^R reported by the company

Update log

2 updates

Thu 26 Sep 2024

Major: Canon delivers first FPA-1200NZ2C system to Texas Institute for ElectronicsPressHardware

Fri 13 Oct 2023

Major: Canon announces FPA-1200NZ2C nanoimprint lithography systemPressHardware

About Canon

The team behind FPA-1200NZ2C

Canon

Cameras, printers, nanoimprint lithography

Canon is a Japanese multinational imaging corporation with strengths in optics and precision manufacturing. It has moved into semiconductor equipment, including nanoimprint lithography systems for advanced chip patterning.

Canon applies its expertise in optics and precision manufacturing to semiconductor lithography.
In 2023, Canon introduced FPA-1200NZ2C nanoimprint lithography for sub-5nm patterning.

global.canon (opens global.canon)Company profile →

Founded: 193789 yrs
Headquarters: Japan
Status: Public
Listed: 7751 (opens google.com)TSE
Valuation: public
Staff: ~165,547Jan 2025
Works in: ComputingChipmaking tools
Coverage: 1 program · 2 updateslatest 26 Sep 2024checked 10 Oct
People: Fujio MitaraiChairman & CEO

Spec

FPA-1200NZ2C

Minimum feature size

Sub-5nm class^R (reported)