The brief
- Record Q2 2026 revenue of €1,003M (+24% at constant currency), driven by 2nm logic and HBM memory.
- Over 55% of single-wafer ALD; gate-all-around added US$400M to its market per 100k wafers/month.
- Expects 2026 revenue above €4B and Q3 2026 at about €1.1B.
Technical approach
Films built one atomic layer at a time
Two gases are pulsed in turn; each reacts only with the surface, adding one atomic layer per cycle, so films coat deep 3D shapes evenly.
Growing the transistor channel
Epi grows stacked silicon and silicon-germanium crystal layers; in gate-all-around chips these stacks become the transistor's channels.
Molybdenum instead of tungsten and copper
ALD molybdenum needs no liner, cutting resistance in tiny vias; ASM reports wins for it at the 1.4 nm node.
