TEL launches Acrevia, a gas cluster beam tool that reshapes EUV-printed patterns

Tokyo Electron/CLEAN TRACK LITHIUS Pro Z

Tokyo Electron launched Acrevia, which fires a beam of gas clusters at tilted wafers to trim the width and shape of patterns printed by EUV lithography. It is meant to reduce edge roughness and random printing defects and cut the need for costly repeated EUV exposures.

• Uses location-specific processing to vary the etch amount across the wafer.
• Aimed at fewer EUV multi-patterning steps and better yield.
• TEL also announced new single-wafer deposition systems at the same time.