StoryHardware
SK hynix ships 12-layer HBM4E samples to AI customers with 16 Gbps per pin
SK hynix began shipping samples of its HBM4E memory to major customers, achieving 16 Gbps per pin and 48 GB capacity in 12-layer stacks. The new generation delivers over 20% better power efficiency and 17% improved heat dissipation versus HBM4, using SK hynix's 6th-generation 10nm-class DRAM. Samples are in customer evaluation for 2027 AI platform deployments.