SK hynix plans TSMC 3nm for future custom HBM4E logic dies

SK hynix is exploring TSMC's 3nm process for future custom HBM4E variants planned for 2027, while shipping standard HBM4E with its own 10nm-class DRAM in 2026. This approach allows SK hynix to offer premium, customer-specific configurations later for applications requiring bespoke logic, competing with Samsung's similar strategy.