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Intel reports about 95% of quantum-dot devices working across a 300 mm spin-qubit wafer
Intel reported a 95% yield of working quantum-dot devices across a full 300 mm silicon wafer, testing over 900 single and 400 double quantum dots at 1.7 kelvin. The achievement demonstrates that standard chip manufacturing, not lab-built devices, is the route to millions of qubits.
- 95% yield on 300mm wafer using EUV lithography, enabling statistical process control methods
- Tested over 900 single quantum dots and 400 double quantum dots in under 24 hours using cryoprober
- Fabricated with standard transistor techniques at Intel's D1D fab in Oregon, scaling approach differs from competitors