CXMT plans to mass-produce HBM3E 12-high starting in 2027 after HBM3E 8-high reaches mass production in 2026

ChangXin Memory Technologies/HBM3E & DRAM

CXMT announced plans to shift roughly 20% of its DRAM output to HBM3E production. The company is beginning HBM3E 8-high mass production in 2026 and targeting HBM3E 12-high mass production in 2027, positioning itself to supply Chinese AI accelerator makers and closing the gap with global HBM leaders.

• HBM3E 8-high moving to mass production in 2026 at CXMT's existing fabs.
• 12-high variant planned for 2027 as volume ramps.
• Shift enables CXMT to serve AI chip demand within China, reducing reliance on Samsung, SK Hynix, and Micron.
• CXMT plans multi-billion dollar IPO to fund fab expansion.