ASML plans to raise low-NA EUV capacity about 30% in 2027, from around 65 tools in 2026

ASML/Low-NA EUV (NXE)

With its Q2 2026 results, ASML said it plans to raise its capacity for standard (low-NA) EUV lithography machines by 30% in 2027, from about 65 systems in 2026, and is studying another 30% for 2028. EUV machines print the finest layers of leading-edge chips, so their supply limits how fast AI chip output can grow. ASML also raised its 2026 sales outlook to EUR 43-45 billion.

• Q2 2026: net sales EUR 9.3 billion, net income EUR 2.9 billion, gross margin 54.0%, 86 lithography systems shipped (67 in Q1).
• ASML plans the same 30% step-up for DUV immersion tools, from about 130 in 2026, with another 30% under study for 2028.
• Q3 2026 guidance: EUR 11-12 billion in sales at a 55-57% gross margin.
• CEO Christophe Fouquet said AI investment is driving demand for advanced logic and memory chips, with customers accelerating fab expansion plans.