U.S. DRAM Fabs (Idaho & New York) by Micron Technology: status and timeline

U.S. DRAM Fabs (Idaho & New York)

Establish leading-edge DRAM and HBM production in the U.S. to serve AI demand and reduce supply chain reliance on Taiwan and South Korea.

DeployStage 4 of 5

ID1 wafer production targeted mid-2027. ID2 late 2028. Clay NY fab 2030.

Updated Apr 2024Checked 11 Oct0 updates this week

Milestones

Next · ID1 DRAM wafer production begins

ID1 DRAM wafer production beginsTarget Jul 2027Not yet reached.
ID2 construction beginsTarget Q4 2026Not yet reached.
ID2 initial wafer outputTarget Q4 2028Not yet reached.
Clay NY Phase 1 fab operationalTarget 2030Not yet reached.

Most important updates

Micron receives $6.1B CHIPS Act funding for U.S. DRAM and HBM manufacturing in Idaho and New YorkApr 2024

Upcoming

Q4 2026ID2 construction begins (next)
Jul 2027ID1 DRAM wafer production begins
Q4 2028ID2 initial wafer output
2030Clay NY Phase 1 fab operational

Current obstacles

Multi-year construction timelinesFabs need 3-4 years minimum from groundbreaking to production. Supply chain, labor, and permitting delays can slip timelines.
Equipment supply constraintsLithography and etch tools have 18-24 month lead times. Supply bottlenecks from ASML and other vendors can delay ramp.
Cost escalationConstruction and equipment costs are sensitive to inflation and supply chain disruptions. Budget overruns can result from geopolitical factors.

Physics limits

Fab construction takes yearsBuilding a leading-edge fab from groundbreaking to first wafer typically requires 3-4 years minimum, constrained by permitting, labor, and material availability.
Equipment lead timesAdvanced lithography and etch tools must be ordered 18-24 months in advance. Capacity expansion is ultimately gated by tool suppliers' production rates.
Yield ramp takes timeNew fabs require 12-24 months to achieve commercial wafer throughput as process recipes are optimized and yields improve.

How it works

3 parts

DRAM Production

Advanced memory wafer fab

Sub-10nm DRAM manufacturing for servers, AI systems, and PCs.

Multi-fab Strategy

Phased capacity expansion

Idaho facilities (ID1, ID2) deliver near-term DRAM and HBM capacity. Clay NY represents long-term scaling, with multiple fabs planned over 20+ years.

Supply Chain

Domestic semiconductor ecosystem

U.S. manufacturing reduces reliance on Taiwan and South Korea, supporting national semiconductor sovereignty and AI infrastructure resilience.

Spec sheet

Spec	U.S. DRAM Fabs (Idaho & New York)
ID1 wafer production start	Mid 2027^R (reported)
ID2 wafer production start	Late 2028^R (reported)
Clay NY first fab wafer start	2030^R (reported)
CHIPS Act direct funding (awarded)	$6.1 billion^R (reported)
Total U.S. investment through 2035	$250+ billion^R (reported)

^R reported by the company

Update log

1 update

Apr 2024

Major: Micron receives $6.1B CHIPS Act funding for U.S. DRAM and HBM manufacturing in Idaho and New YorkPressFunding

About Micron Technology

The team behind U.S. DRAM Fabs (Idaho & New York)

Micron Technology

HBM4, AI memory, DRAM

Micron designs and manufactures memory and storage for AI data centers, PCs and mobile devices. Founded in Boise, Idaho, it is the third-largest DRAM maker and the only US HBM supplier. In 2026, it ramped HBM4 to 18% market share.

Micron began shipping HBM4 in March 2026 for NVIDIA Vera Rubin, hitting $1B sales in 4 months.
In Q2 2026, Micron held 18% HBM market share; it aims for 20% by year-end.
The company signed 16 strategic customer agreements with hyperscalers for long-term HBM supply.

micron.com (opens micron.com)Company profile →

Founded: 197848 yrs
Headquarters: United States
Status: Public
Valuation: public
Staff: ~53,000Jan 2025
Works in: ComputingPackaging & memory
Coverage: 2 programs · 4 updateslatest 1 Jun 2026checked 10 Oct
Customers: NVIDIA (opens nvidia.com)Google Cloud (opens cloud.google.com)
People: Sanjay Mehrotra (opens investors.micron.com)CEO and Chairman

Spec

U.S. DRAM Fabs (Idaho & New York)

ID1 wafer production start

Mid 2027^R (reported)

ID2 wafer production start

Late 2028^R (reported)

Clay NY first fab wafer start

2030^R (reported)

CHIPS Act direct funding (awarded)

$6.1 billion^R (reported)

Total U.S. investment through 2035

$250+ billion^R (reported)