YMTC shows Xtacking 3.0, a 232-layer 1 Tb TLC die with 2,400 MT/s I/O

YMTC (Yangtze Memory)/Xtacking 3D NAND

YMTC presented the X3-9070, a 1-terabit TLC flash die from 232-layer NAND built with Xtacking 3.0, claiming 50% faster I/O and up to 25% lower power than its previous chips. The design moved the source connection to the back side to simplify processing; YMTC gave few further details at the time.

• I/O speed 2,400 MT/s, 50% above the prior generation.
• Six independent planes for faster random and sequential access.
• Logic wafer is bonded on top of the memory array with millions of tiny vias.