SK hynix begins mass production of the first 12-layer HBM3E, with 36 GB per stack

SK hynix

SK hynix began mass production of the first 12-layer HBM3E with 36 GB per stack, the largest HBM capacity at the time. The stacked memory design achieves 9.6 Gbps speed with 10% better heat dissipation and 40% thinner chips, enabling faster AI model processing.

• First-ever 12-layer HBM3E configuration with 36 GB capacity, up from previous 24 GB maximum on 8-layer HBM3E.
• Memory speed reaches 9.6 Gbps, industry-fastest available; chips made 40% thinner while increasing capacity 50%, improving density.
• A single GPU with four chips can process a 70-billion-parameter AI model 35 times per second, demonstrating practical AI acceleration value.