StoryHardware
Huawei announces three-year roadmap for Ascend 950, 960 and 970 chips with annual release cycle
HuaweiAscend 950 / Atlas 950 SuperPoD
At Huawei Cloud 2025, Huawei unveiled a three-year roadmap for Ascend AI chips: the 950 series in Q1 2026 (prefill) and Q4 2026 (training), the 960 in Q4 2027 and the 970 in Q4 2028, each doubling compute versus its predecessor. The 950 will be the first to use Huawei's proprietary HBM—HiBL 1.0 on the 950PR and HiZQ 2.0 on the 950DT—cutting cost and reducing supply-chain dependence.