Instinct MI300 and MI350

Current obstacles

Physics limits

• Crossing between chiplets costs energySplitting a GPU into chiplets improves yield, but every bit that crosses from one die to another costs more energy and time than a wire on a single die. That limits how finely a design can be split.
• Stacking traps heatCompute dies sit on top of I/O dies, so heat from the upper layer must pass through or around the lower one. Stacked designs must run cooler or slower than flat ones.
• Big dies rarely come out flawlessDefects land randomly on wafers, so the chance a die has none falls exponentially with its area. That statistic, not taste, is why large GPUs are built from chiplets.