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Tempo and 2D-chip roadmapIonQ—Tempo and 2D-chip roadmapIonQ—Quantum networkingIonQ—Tempo and 2D-chip roadmapIonQ—Tempo and 2D-chip roadmapIonQ—

IonQ

Trapped-ion computers, quantum networking, chip fab

USpublicest. 2015ionq.com (opens ionq.com)Checked 25 Sep

The brief

Analyst view
  • Closed its $1.8B purchase of chip maker SkyWater on 31 July 2026, gaining its own fab.
  • Reported 99.99% two-qubit fidelity in October 2025 using Oxford Ionics' electronic control.
  • Raised $2B in equity in October 2025, one of the sector's largest raises.

Technical approach

As reported
Electronic control

Microwave gates on chip

Qubits are driven by electrodes and microwaves built into the chip, not many lasers. That means standard fabs can make it.

2D traps

Scaling on-chip

Plans 2D trap chips with thousands, then tens of thousands, of ions each, made at SkyWater.

Networking

Linking chips with light

Ions emit photons that link chips together, using tech from buys such as Lightsynq, to reach millions of qubits.

Programs

IonQ, two programs

Updated 18d ago
Tempo and 2D-chip roadmapIonQ's current system and its roadmap to electronically controlled chips: about 10,000 qubits on a chip around 2027, and 2 million (80,000 logical) by 2030.DeployNextFirst electronically controlled 2D chip system · 2026Updated 18d agoView program →Quantum networkingIonQ's networking arm. It combines quantum key sharing (QKD) products, Lightsynq's quantum memory and Capella's satellites, aiming to link quantum computers and build a space network.PilotNextIon-photon entanglement between separate systemsUpdated 19d agoView program →
Research · Proto · Pilot · Deploy · Scaling

Research & demos

2 items

Open technical problems

Open · Active · Partial
  • Photonic link ratesActive research

    Linking ions on separate chips via light is still far slower than local gates, so linked chips can't yet act as one.

  • Integration riskOpen

    Six acquisitions in two years (Oxford Ionics, ID Quantique, Capella, Lightsynq, Vector Atomic, SkyWater) must merge into one plan.

Upcoming catalysts

Company-wide
  • 2027First Superion 256 customer deliveriesTempo and 2D-chip roadmapby ~15 mo

Peers

Trapped ion · 1

Company & funding

3 rounds · as reported
Raised
$3Bdisclosed private rounds
Last round
Equity offeringOct 2025
HQ
US
Founded
2015
DateRoundAmountPost-moneyLead
Oct 2025Equity offering$2B—Heights Capital Management
Jul 2025Equity offering$1B—Heights Capital Management
Oct 2021SPAC listing (dMY III)$636M——

Partners & customers

3 partners · 2 customers

People

Key people
Primer