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TheTechno Optimist.

MIRACuspAI—

CuspAI

AI materials design platform

GB$2.6B privateest. 2024Checked 25 Sep

The brief

Analyst view
  • $450M Series B (July 2026) led by Kleiner Perkins and NEA, with Bezos Expeditions.
  • Formed a chemical research group including NVIDIA and Samsung Electronics.
  • Its MIRA platform aims to cut materials design from years to months.
Programs

CuspAI, one program

Updated 20 Jul 2026
MIRAGenerative AI plus simulation that proposes materials with the properties you ask for, such as materials that soak up CO2 for carbon capture.PilotNextMaterials validated in partner labsUpdated 20 Jul 2026View program →
Research · Proto · Pilot · Deploy · Scaling

Peers

AI materials discovery · 1

Company & funding

1 round · as reported
Valuation
$2.6Bprivate
Raised
$450Mdisclosed private rounds
Last round
Series B20 Jul 2026
HQ
GB
Founded
2024
DateRoundAmountPost-moneyLead
20 Jul 2026Series B$450M$2.6BKleiner Perkins, NEA

Partners & customers

2 partners

People

Key people
Primer