# Besi joins Applied Materials' EPIC Center, widening their hybrid bonding partnership

Canonical page: https://technooptimist.io/stories/besi-joins-applied-materials-epic-center-widening-their-hybrid-bonding-d4ed2d9a
Date: 1 Oct 2026
About: [Besi (BE Semiconductor Industries)](https://technooptimist.io/companies/besi.md) · [Besi hybrid bonding systems](https://technooptimist.io/computing/hybrid-bonding.md)
Original source: https://finviz.com/news/397813/applied-materials-and-besi-expand-strategic-partnership-to-advance-next-generation-packaging-for-ai-scaling

Besi became an Innovation Partner at Applied Materials' EPIC Center in Silicon Valley, extending a collaboration that began in 2020 at a joint hybrid bonding centre in Singapore and produced Kinex. Joint R&D now covers new die-to-wafer hybrid bonders, thermocompression bonding, die-on-panel integration and co-packaged optics.

## Key facts

- Besi engineers will work alongside Applied's teams at the EPIC Center.
- Applied brings etch, planarization, deposition, cleaning and metrology; Besi brings die placement.
- EPIC capital spending is expected to grow to about $5B over time.

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